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Compact, Efficient Power Modules with MagPack Technology for Industrial and Communication Applications

Compact, Efficient Power Modules with MagPack Technology for Industrial and Communication Applications

Texas Instruments (TI) has launched six new power modules designed to enhance power density, efficiency, and EMI (Electromagnetic Interference) reduction. These new modules feature TI's MagPack integrated magnetic packaging technology, which makes the modules up to 23% smaller than those from competing brands.

Juli 18, 2024

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